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技術支持

TECHNICAL SUPPORT

類型

Type

封裝規格

Package

負載

Load Capacitance

(pF)

常溫頻差

Freq. Tol.@25℃

(ppm)

溫度特性

Freq.Stability

(ppm)

溫度范圍

Temp. Range

特殊要求

Special

-

頻率

Freq.

M 表晶32.768 

  Tuning Fork

C 貼片晶體諧振器

  Chip Quartz Crystal

G 貼片晶體諧振器

  Chip Quartz Crystal(Glass)

S 49US

A:1612

B:2016

C:2520

D:3215

E:3225

F:5032

G:6035

H:7050

K:8045

I:49S

J:49SMD

K:1x4

L:2x6

M:3x8

N:1610

P:2012

Q:6.9x1.4

R:8.0x3.8

X:12.5

A:6

B:7

C:8

D:9

E:10

F:12

G:15

H:16

I:18

J:20

K:22

L:25

M:30

N:32

P:50

O:No 

S:Series

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:0 ~ +40

B:0 ~ +50

C:0 ~ +60

D:0 ~ +70

E:0 ~ +80

F:0 ~ +85

G:-10 ~ +60

H:-20 ~ +70

I:-30 ~ +85

J:-40 ~ +85

K:-40 ~ +95

L:-40 ~ +105

M:-40 ~ +125

N:-40 ~ +150

P:-55 ~ +125

A:Auto

N:Non Auto

-

類型

Type

封裝規格

Package

供應電壓

Supply V(V)

三態

Tri-State Fun.

總頻差

Freq. 

Stability

(ppm)

溫度范圍

Operating Temp. 

Range


輸出信號模式

Output Logic 

And Symmetry

振蕩模式

Oscillator

Mode

-

頻率

Freq.

O 貼片晶體振蕩器

  SMD Crystal Oscillator (CMOS)

L 貼片晶體振蕩器

  SMD Crystal Oscillator (LVPECL/LVDS)

P 貼片編程晶體振蕩器

  Programmable SMD Crystal Oscillator

V 貼片壓控晶體振蕩器

  SMD VCXO Crystal Oscillator

T 貼片溫補晶體振蕩器

  SMD TCXO Crystal Oscillator

A:1612

B:2016

C:2520

D:3215

E:3225

F:5032

G:6035

H:7050

K:8045

I:49S

J:49SMD

U:8038

V:6914

W:1610

X:2x6

Y:3X8

Z:14.2x9.3

E:2.8/3.0/3.3

J:2.5

K:1.8

P:1.5

L:1.2

M:0.9

T:Fixed-Freq With Tri-State

M:Multiplier-Freq With Tri-State(Only For F/H Package)

U:Ultra Low Noise Design

N:NA

A:±5

B:±10

C:±15

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

P:±0.5

Q:±1.0

R:±1.5

S:±2.0

T:±2.5

U:±3.0

V:±3.5

W:±4.0

X:±4.5

A:0 ~ +40

B:0 ~ +50

C:0 ~ +60

D:0 ~ +70

E:0 ~ +80

F:0 ~ +85

G:-10 ~ +60

H:-20 ~ +70

I:-30 ~ +85

J:-40 ~ +85

K:-40 ~ +95

L:-40 ~ +105

M:-40 ~ +125

N:-40 ~ +150

P:-55 ~ +125

J:CMOS 15pF/50±5%

K:CMOS 15pF/50±10%

L:LVPECL/50±5%

V:LVDS/50±5%

M:HCSL/50±5%

N:HCMOS 15pF/50±5%

H:HCMOS 15PF/50±10%

A:AT 

T:AT 3rd Overtone

-

類型

Type

封裝規格

Package

供應電壓Supply V(V)

牽引范

Pulling  Range

(ppm)

總頻差

Freq. Stability

(ppb)

溫度范圍

Operating Temp.Range

輸出信號模式

Output Logic 

And Symmetry


振蕩模式

Oscillator

Mode


引腳分配

Pin out

含鉛狀態

Lead Free

-

頻率

Freq.

N 恒溫晶體振蕩器

OCXO Crystal Oscillator

A:14.3x9.3

(SMD)

B:20.3x12,7

C:20.6x20.6

D:25.4x22.1

(SMD)

E:25.4x25.4

F:36.3x27.2

A:3.3

B:5

C:12

A:±0.2

B:±0.4

C:±1

D:±3

E:±5

F:No VC Function

A:±2

B:±5

C:±10

D:±20

E:±25

F:±30

G:±40

H:±50

I:±100

J:±150

K:±200

L:±500

M:±1000

A:0 ~ +50

B:0 ~ +70

C:-30 ~ +70

D:-40 ~ +85

A:Sinewave

B:CMOS15pF/50±5%

H:Not

Not selectable by custome

N:Normal

"(Pleaserefer 

to ""outline drawing"""

F:RoSH Complian-

固定類型

Assembly type

標稱頻率

Nominal Freq.(KHz)

波束類型

Beam type

外殼種類

Case type

連接線種類

Wire type

UA:Passive combination probe

UB:Active combination probe(Analog)

UC:Active combination probe(Digital)

UD:Active combination probe(LIN-BUS,CAN-BUS)

UE:Closed sensor core(T/R)

UK:Open sensor core(T/R)

UT:Open sensor core(T)

UR:Open sensor core(R)

DM:Matching layer Closed sensor core

40:40.0

48:48.0

52:52.0

55:55.5

58:58.0

62:62.0

68:68.0

2H:200

3H:300

4H:400

1M:1000

S:Symmetric 

X=Y

D:Dissymmetric

X>Y

A:14x9 Aluminum case

B:15x9 Aluminum case

C:15.5x9 Aluminum case

D:16x12 Aluminum case

E:16x12 Plastic case

F:18.7x10.5(DM)

G:13.0x9.0(DM)

H:11.0x10.0(DM)

L:Plastic composite housing(Plane)

M:Plastic composite housing(Dip angle)

S:Customer-specified

N:Not specified

1:Stranded wire with Terminal

2:Screw waterproof joint wire(2.5M)

3:Standard shielded wire(2.5M)

4:Pin

5:AV cable

9:Customer-specified

0:Not specified

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